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Qualcomm Snapdragon 778G Plus SM7325-AE Specification

Posted on 12 February 202212 February 2022 By HSR
2 min read

Qualcomm Snapdragon 778G Plus – an 8-core chipset that was announced on October 27, 2021, and is manufactured using a 6-nanometer process technology. It has 1 core Kryo 670 Prime (Cortex-A78) at 2500 MHz, 3 cores Kryo 670 Gold (Cortex-A78) at 2200 MHz, and 4 cores Kryo 670 Silver (Cortex-A55) at 1900 MHz.

Qualcomm Snapdragon 778G Plus SM7325-AE Specification

LaunchOct 2021
StatusAvailable
ClassMidrange
Model NumberSM7325-AE
Chip NameQualcomm Snapdragon 778G Plus

CPU

Architecture1x 2.5 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
Process6nm
64 Bit64 Bit support
Coresocta- core (8)
Instruction setARMv8.4-A
Frequency2500MHz

GPU

GPUAdreno 642L
ArchitectureAdreno 600
OpenCL version2.0
Vulkan version1.1
Direct X version12

MEMORY(RAM)

Memory TypeLPDDR5
Memory Frequency3200 MHz
Max size16GB
Bus2x 16 Bit
Max bandwidth25.6 Gbit/s

MULTIMEDIA (ISP)

Neural processor (NPU)Hexagon 770
Storage typeUFS 3.0, UFS 3.1
Max display resolution2520 x 1080
Max camera resolution1x 192MP
Video capture4K at 30FPS
Video playback4K at 30FPS
Video codecsH.264, H.265, AV1, VP9
Audio codecsAIFF, CAF, MP3, MP4, WAV,AAC

CONNECTIVITY

ModemX53
4G supportLTE Cat. 24
5G supportYes
Wi-Fi6
Download speedUp to 1200 Mbps
Upload speedUp to 210 Mbps
Bluetooth5.2
NavigationGPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Also read : Mediatek Dimensity 1200 5G

Mobile Processors Tags:Snapdragon Processors

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