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HiSilicon Kirin 9000 Specification

Posted on 23 February 202223 February 2022 By HSR
2 min read

HiSilicon Kirin 9000 – an 8-core chipset that was announced on October 22, 2020, and is manufactured using a 5-nanometer process technology. It has 1 core Cortex-A77 at 3130 MHz, 3 cores Cortex-A77 at 2540 MHz, and 4 cores Cortex-A55 at 2050 MHz.

HiSilicon Kirin 9000 Specification

LaunchOct 2020
StatusAvailable
ClassFlagship
Chip NameHiSilicon Kirin 9000

CPU

Architecture1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
Process5nm
64 Bit64 Bit support
Coresocta- core (8)
Instruction setARMv8.2-A
Frequency3130 MHz

GPU

GPUMali-G78 MP24
ArchitectureValhall 2
Execution units24
Shading units384
OpenCL version2.0
Vulkan version1.1
Direct X version12

MEMORY(RAM)

Memory TypeLPDDR5
Memory Frequency2750 MHz
Max size16GB
Bus4x 16 Bit
Max bandwidth44 Gbit/s

MULTIMEDIA (ISP)

Neural processor (NPU)AI accelerator
Storage typeUFS 3.1
Max display resolution3840 x 2160
Video capture4K at 60FPS
Video playback4K at 60FPS
Video codecsH.264, H.265, VP9
Audio codecsAAC, AIFF, CAF, MP3, MP4, WAV

CONNECTIVITY

ModemBalong 5000
4G supportLTE Cat. 24
5G supportYes
Wi-Fi6
Bluetooth5.2
NavigationGPS, GLONASS, Beidou, Galileo, NAVIC

Also read : Samsung Exynos 2200 s5e9925 Specification

Mobile Processors Tags:Kirin

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