HeadShotReviews

MediaTek Dimensity 8100 MT6895Z MT6895Z/TCZA Specifications

5 March 202226 June 2022 HSR

Built using the TSMC N5 (5nm-class) production process, the Dimensity 8100(MT6895Z) upgrades gaming with up to 20% more GPU frequency over the Dimensity 8000, and over 25% better CPU power-efficiency over our previous generation Dimensity chips. Mediatek Dimensity 8100 Specifications Model Name MT6895Z MT6895Z/TCZA CPU 4x Arm Cortex-A78 up to 2.85GHz4x Arm Cortex-A55 up to…

Mobile Processors

Mediatek Dimensity 8000 MT6895 Specifications

2 March 20222 July 2022 HSR

Built using the TSMC N5 (5nm-class) production process, the Dimensity 8000(MT6895) upgrades the gaming experience with an octa-core CPU sporting speeds of up to 2.75GHz, plus the latest Arm Mali-G610 MC6 graphics, allowing high frame rate gaming for extended periods in top titles. Mediatek Dimensity 8000 (MT6895) Specifications Model Name MT6895 CPU 4x Arm Cortex-A78…

Mobile Processors

HiSilicon Kirin 9000 Specification

23 February 202223 February 2022 HSR

HiSilicon Kirin 9000 – an 8-core chipset that was announced on October 22, 2020, and is manufactured using a 5-nanometer process technology. It has 1 core Cortex-A77 at 3130 MHz, 3 cores Cortex-A77 at 2540 MHz, and 4 cores Cortex-A55 at 2050 MHz. HiSilicon Kirin 9000 Specification Launch Oct 2020 Status Available Class Flagship Chip…

Mobile Processors

Qualcomm Snapdragon 778G Plus SM7325-AE Specification

12 February 202215 September 2022 HSR

Qualcomm Snapdragon 778G Plus SM7325-AE – an 8-core chipset that was announced on October 27, 2021, and is manufactured using a 6-nanometer process technology. It has 1 core Kryo 670 Prime (Cortex-A78) at 2500 MHz, 3 cores Kryo 670 Gold (Cortex-A78) at 2200 MHz, and 4 cores Kryo 670 Silver (Cortex-A55) at 1900 MHz snapdragon…

Mobile Processors

Qualcomm Snapdragon 750G SM7225 Specification

12 February 202212 February 2022 HSR

Qualcomm Snapdragon 750G SM7225 – an 8-core chipset that was announced on September 23, 2020, and is manufactured using a 8-nanometer process technology. It has 2 cores Kryo 570 Gold (Cortex-A77) at 2200 MHz and 6 cores Kryo 570 Silver (Cortex-A55) at 1800 MHz. Qualcomm Snapdragon 750G SM7225 Specification Launch Sep 2020 Status Available Class…

Mobile Processors

Samsung Exynos 2200 s5e9925 Specification

10 February 202223 February 2022 HSR 1 Comment

Samsung Exynos 2200 – an 8-core chipset that was announced on January 18, 2022, and is manufactured using a 4-nanometer process technology. It has 1 core Cortex-X2 at 0 MHz, 3 cores Cortex-A710 at 2400 MHz, and 4 cores Cortex-A510 at 1800 MHz. Samsung Exynos 2200 (s5e9925) Specification Launch Jan 2022 Status Available Class Flagship…

Mobile Processors

Qualcomm Snapdragon 480 Plus SM4350-AC Specification

8 February 202222 February 2022 HSR

Qualcomm Snapdragon 480 Plus – an 8-core chipset that was announced on October 27, 2021, and is manufactured using a 8-nanometer process technology. It has 2 cores Kryo 460 Gold (Cortex-A76) at 2200 MHz and 6 cores Kryo 460 Silver (Cortex-A55) at 1800 MHz. Qualcomm Snapdragon 480 Plus SM4350-AC Specification Launch October2021 Status Available Series…

Mobile Processors

MediaTek Dimensity 920 MT6877T Specifications

18 January 202218 January 2022 HSR 1 Comment

MediaTek Dimensity 920 – an 8-core chipset that was announced on August 11, 2021, and is manufactured using a 6-nanometer process technology. It has 2 cores Cortex-A78 at 2500 MHz and 6 cores Cortex-A55 at 2000 MHz. MediaTek Dimensity 920 MT6877T SoC Specifications Launch August 2021 Status Available Series Dimensity series Class Mid Range Model…

Mobile Processors