The new S3 Gen 2 Sound Platform was unveiled by Qualcomm in advance of the 2023 Snapdragon Summit. The new sound platform has a number of audio-focused capabilities including ultra-low latency of 20ms to mention a few and is designed to function with the future flagship Snapdragon 8 Gen 3 chipset. To learn more about the most recent Qualcomm chipset, keep reading.
Qualcomm S3 Gen 2 Chipset Announced
Using Snapdragon Sound technology, the S3 Gen 2 audio chip offers “audiophile-quality music streaming.” In order to turn TVs, computers, and other devices into “broadcast platforms,” dongles and adaptors are intended. The chipset can provide lossless audio up to 48KHz, improve communication, and do many other things.
The chipset is excellent for gaming and supports Bluetooth LE Audio specification (Bluetooth version 4.0 ready) with ultra-low latency of 20ms. As a result, the S3 Gen 2 is compatible with Google Quick Pair, Bluetooth Low Energy, Bluetooth Classic, and Dual-mode Bluetooth. For improved audio quality during conversations, calls, and audio sessions, the chipset incorporates a 3-microphone Qualcomm cVc array with aptX Adaptive Audio and external SRAM.
On the technical side, you should be aware that the new sound platform is built using a 32-bit fabrication method with a CPU that can run at up to 80 MHz. The architecture provides on-chip memory for audio buffering together with external Q-SPI Flash and embedded ROM+RAM for the chipset. With a 240 MHz clock speed, 1024 kB of data Memory, and 384 kB of programme RAM, it houses the Qualcomm Kalimba customizable DSP.
Moreover, Qualcomm Adaptive Active Noise Cancellation is supported, which adjusts to the fit of the earbuds and the environment to cancel out background noise. Also, it has capabilities like stereo recording, aptX Voice technology, 24 bit/96 kHz high-resolution audio, and voice back-channel for in-game conversation.